Product description:
Characteristics:
- Lead-free solder 0.8 mm, ideal for use with microelectronics, fine wires and most other electrical and electronic soldering applications
- Tin-lead has a melting point of 217 °C
- Tin-silver-copper solder has a lower melting point, 207°C, and produces a low-resistance solder joint
- Designed for the toughest jobs where precision is extremely important
Key features according to our expert
-
Thickness: 0,8 mm
-
Length: 2000 mm
-
Based on: Tin
Specifications / All features
- Thickness
- 0,8 mm
- Length
- 2000 mm
- Based on
- Tin
- Solder
- 0.75 Cu 99.25 Sn %
- Total length mm
- 2000 mm
- Weight g
- 10 g