Product description:
- Lead-free solder 0.8 mm
Characteristics:
- Lead-free solder 0.8 mm, ideal for use with microelectronics, fine wires and most other electrical and electronic soldering applications
- Tin-lead has a melting point of 217 °C
- Tin-silver-copper solder has a lower melting point, 207°C, and produces a low-resistance solder joint
- Designed for the toughest jobs where precision is extremely important